Molex Launches MX Connector System to Support E/E Architecture in EVs

At the 2025 Munich Electronics Exhibition, Molex introduced its new MX connector system, designed for the evolving domain-based architecture of electric vehicles (EVs). This modular platform supports up to 400A current-carrying capacity, meeting the increasing power transmission needs of next-generation EVs.

 

Roc Yang, Vice President of Global Sales at Molex, stated that the company is actively responding to trends in electrification and intelligent mobility by delivering innovative technologies and solutions. The MX-DaSH series hybrid CONNECTORS support ultra-high-speed data transmission of up to 224 Gbps, catering to advanced driver-assistance systems (ADAS) and autonomous driving applications.