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The newly introduced NearStack™ 0.35mm pitch connector features an innovative stacked design that reduces PCB space occupancy by 40% while maintaining ultra-low signal loss. This enables more flexible layouts for high-density servers and switches. Industry analysts note that as AI chip computational demands surge, traditional CONNECTORS struggle to meet data throughput requirements, positioning Molex's innovation as a potential new industry standard.
Concurrently, Molex announced a strategic collaboration with leading server manufacturer Inspur Information to co-develop customized interconnect solutions based on PCIe 6.0 standards. Initial products are scheduled for mass production in Q1 2025 – marking a significant step toward technological autonomy for China's high-end data center equipment sector.
Molex also showcased its wearable device micro-connector series at the exhibition, where the 0.2mm ultra-thin FPC connector sparked significant interest among consumer electronics manufacturers. Counterpoint Research data indicates global IoT device shipments will reach 1.8 billion units in 2024, driving continuous demand for miniaturized, low-power connectors.
Notably, Molex disclosed its "2030 Sustainability Roadmap" during the press conference, committing to increase recycled material usage in next-gen connectors to 30% and reduce e-waste through modular designs. This initiative has earned recognition from environmental certification body TCO Certified.
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Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.