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Home> Industry News> Molex Unveils Next-Gen High-Speed Connector Solutions for 5G & AI Data Center Upgrades
June 12, 2025

Molex Unveils Next-Gen High-Speed Connector Solutions for 5G & AI Data Center Upgrades

[Shanghai, China – June 12, 2024] Global electronics connectivity leader Molex today launched its newly developed high-speed backplane connector system at Electronica China 2024. Designed specifically for 5G communications, AI data centers, and high-performance computing (HPC), the solution supports data rates of 56Gbps and beyond, potentially resolving bandwidth bottlenecks in next-generation infrastructure.

Tech Spotlight: Engineering Breakthrough

The newly introduced NearStack™ 0.35mm pitch connector features an innovative stacked design that reduces PCB space occupancy by 40% while maintaining ultra-low signal loss. This enables more flexible layouts for high-density servers and switches. Industry analysts note that as AI chip computational demands surge, traditional CONNECTORS struggle to meet data throughput requirements, positioning Molex's innovation as a potential new industry standard.

Strategic Partnership Update

Concurrently, Molex announced a strategic collaboration with leading server manufacturer Inspur Information to co-develop customized interconnect solutions based on PCIe 6.0 standards. Initial products are scheduled for mass production in Q1 2025 – marking a significant step toward technological autonomy for China's high-end data center equipment sector.

Market Response

Molex also showcased its wearable device micro-connector series at the exhibition, where the 0.2mm ultra-thin FPC connector sparked significant interest among consumer electronics manufacturers. Counterpoint Research data indicates global IoT device shipments will reach 1.8 billion units in 2024, driving continuous demand for miniaturized, low-power connectors.

ESG Advancements

Notably, Molex disclosed its "2030 Sustainability Roadmap" during the press conference, committing to increase recycled material usage in next-gen connectors to 30% and reduce e-waste through modular designs. This initiative has earned recognition from environmental certification body TCO Certified.

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Hongkong Suntex Electronic Co., Ltd. Hong Kong Suntex Electronics is a comprehensive manufacturer in the wire harness industry. The company was established in 2009. For over 15 years, we have always adhered to the pursuit of...

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